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| Flip-Up |
| United States Patent Application | 20180024370 |
| Kind Code | A1 |
| Carollo; Jerome T. ; et al. | January 25, 2018 |
MICRODISPLAY BASED IMMERSIVE HEADSET
Abstract
An immersive headset device is provided that includes a display portion and a body portion. The display portion may include microdisplays having a compact size. The microdisplays may be movable (e.g., rotational) relative to the body portion and can be moved (e.g., rotated) between a flipped-up position and a flipped-down position. In some instances, when the microdisplays are flipped up, the headset provides an augmented reality (AR) mode to a user, and when the microdisplays are flipped down, the headset provide a virtual reality (VR) mode to the user. In certain implementations, the headset includes an electronics source module to provide power and/or signal to the microdisplays. The electronics source module can be attached to a rear of the body portion in order to provide advantageous weight distribution about the head of the user.
| Inventors: | Carollo; Jerome T.; (Carlsbad, CA) ; Ghosh; Amal; (Hopewell Junction, NY) ; Ho; John C.; (Woodinville, WA) ; Rosen; Andrew T.; (Lynnwood, WA) |
| Applicant: |
| Name | City | State | Country | Type |
|---|
eMagin Corporation |
Hopewell Junction |
NY |
US | |
|
|---|
| Family ID: | 1000002914381 |
| Appl. No.: | 15/646390 |
| Filed: | July 11, 2017 |
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